CVE record
CVE-2026-21385
Qualcomm Multiple Chipsets Memory Corruption Vulnerability
Multiple Qualcomm chipsets contain a memory corruption vulnerability while using alignments for memory allocation.
CVE evidence
Known exploitation
Listed in CISA KEV
Absence from the fetched catalog does not establish that exploitation has not occurred.
Severity
unknown
No parseable CVSS vector returned
Affected packages
0
Supported package records returned by OSV. Vendor and product names are not used to infer matches.
CISA Known Exploited Vulnerabilities
Catalog record
- Vendor / project
- Qualcomm
- Product
- Multiple Chipsets
- Date added
- Mar 3, 2026
- CISA federal remediation due date
- Mar 24, 2026
- Required action
- Apply mitigations per vendor instructions, follow applicable BOD 22-01 guidance for cloud services, or discontinue use of the product if mitigations are unavailable.
- Known ransomware campaign use
- Unknown
- CWE
- CWE-190
OSV package mapping
Affected open-source packages
OSV did not return a package mapping in the five supported ecosystems. RequestGuard does not infer package names from the CISA vendor or product fields.