CVE record
CVE-2022-22071
Qualcomm Multiple Chipsets Use-After-Free Vulnerability
Multiple Qualcomm chipsets contain a use-after-free vulnerability when process shell memory is freed using IOCTL munmap call and process initialization is in progress.
CVE evidence
Known exploitation
Listed in CISA KEV
Absence from the fetched catalog does not establish that exploitation has not occurred.
Severity
unknown
No parseable CVSS vector returned
Affected packages
0
Supported package records returned by OSV. Vendor and product names are not used to infer matches.
CISA Known Exploited Vulnerabilities
Catalog record
- Vendor / project
- Qualcomm
- Product
- Multiple Chipsets
- Date added
- Dec 5, 2023
- CISA federal remediation due date
- Dec 26, 2023
- Required action
- Apply remediations or mitigations per vendor instructions or discontinue use of the product if remediation or mitigations are unavailable.
- Known ransomware campaign use
- Unknown
- CWE
- CWE-416
OSV package mapping
Affected open-source packages
OSV did not return a package mapping in the five supported ecosystems. RequestGuard does not infer package names from the CISA vendor or product fields.